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The wire-cut type of machine arose in the 1960s for making tools from hardened steel. The tool electrode in wire EDM is simply a wire. The tool electrode in wire EDM is simply a wire. To avoid the erosion of the wire causing it to break, the wire is wound between two spools so that the active part of the wire is constantly changing.
After testing foam rollers for several weeks, I concluded the 13-inch TriggerPoint Grid Foam Roller slays its competition. It felt perfect for each muscle group I targeted (legs, glutes, and back ...
The name "multi-tool" is a reference to the many functions that this tool can perform with the range of attachments available. "Master Tool" is also a trade name used in North America, short for the original tool by Fein called the Multi-Master. Attachments are available for sawing, sanding, rasping, grinding, scraping, cutting, and polishing.
Lost-foam casting (LFC) is a type of evaporative-pattern casting process that is similar to investment casting except foam is used for the pattern instead of wax. This process takes advantage of the low boiling point of polymer foams to simplify the investment casting process by removing the need to melt the wax out of the mold.
Materials commonly cut with a water jet include textiles, rubber, foam, plastics, leather, composites, stone, tile, glass, metals, food, paper and much more. [46] "Most ceramics can also be cut on an abrasive water jet as long as the material is softer than the abrasive being used (between 7.5 and 8.5 on the Mohs scale)". [47]
The basic plasma cutting process involves creating an electrical channel of superheated, electrically ionized gas i.e. plasma from the plasma cutter itself, through the workpiece to be cut, thus forming a completed electric circuit back to the plasma cutter through a grounding clamp.
A jigsaw power tool is made up of an electric motor and a reciprocating saw blade. Jigsaws with sole plates that have a beveling function can cut angles typically up to 45 degrees relative to the normal vertical stroke to make miter joints. Portable jigsaws have historically been mains-powered, but are increasingly being displaced by battery ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
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