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2. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm Micro ball grid array ( μBGA ): Ball spacing less than 1 mm Thin fine-pitch ball grid array ( TFBGA ): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm

3. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.

4. Solder ball - Wikipedia

   en.wikipedia.org/wiki/Solder_ball

   The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] The ball grid array, chip-scale package, and flip chip packages generally use solder ...

5. Printed circuit board - Wikipedia

   en.wikipedia.org/wiki/Printed_circuit_board

   An example is ball grid array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste. Other platings used are organic solderability preservative (OSP), immersion silver (IAg), immersion tin (ISn), electroless nickel immersion gold (ENIG) coating, electroless nickel electroless ...

6. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The size and shape of the metal particles in the solder paste determines how well the paste will "print". A solder ball is spherical in shape; this helps in reducing surface oxidation and ensures good joint formation with the adjoining particles. Irregular particle sizes are not used, as they tend to clog the stencil, causing printing defects.

7. Embedded wafer level ball grid array - Wikipedia

   en.wikipedia.org/wiki/Embedded_Wafer_Level_Ball...

   Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...

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9. Integrated circuit packaging - Wikipedia

   en.wikipedia.org/wiki/Integrated_circuit_packaging

   However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8] Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types.