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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.

3. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   The equipment and materials used in this stage are a stencil, solder paste, and a printer. The stencil printing function is achieved through a single material namely solder paste which consists of solder metal and flux. Paste also acts as an adhesive during component placement and solder reflow. The tackiness of the paste enables the components ...

4. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process

5. Thick-film technology - Wikipedia

   en.wikipedia.org/wiki/Thick-film_technology

   There are numerous steps in thick film manufacturing which need careful control, like roughness of the substrate, curing temperatures and times of pastes, selected stencil thickness vs. paste type, etc., [10] [11] Therefore the number of pastes used and process steps define the complexity of the process and cost of the final product.

6. Graping - Wikipedia

   en.wikipedia.org/wiki/Graping

   The graping phenomenon can be resolved utilizing proper solder materials in addition to correct reflow profile settings. Solder powders are available that provide a tighter distribution range as well as a high oxidation barrier. This barrier not only improves the paste release from the stencil, but also provides an ideal surface area-to-volume ...

7. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Example Ramp to Spike thermal profile. Example of reflow soldering thermal profile.. Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.

8. Flat no-leads package - Wikipedia

   en.wikipedia.org/wiki/Flat_no-leads_package

   Some key QFN design considerations are pad and stencil design. When it comes to bond pad design two approaches can be taken: solder mask defined (SMD) or non-solder mask defined (NSMD). A NSMD approach typically leads to more reliable joints, since the solder is able to bond to both the top and sides of the copper pad. [4]

9. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Using a stencil for both the balls and the solder paste or flux, Using a BGA "preform" with embedded balls corresponding to the device pattern, or; Using semiautomated or fully automated machinery. For the PS3 and Xbox 360 mentioned above, the time is about 120 minutes if all goes well. [3]