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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   When solder paste is moved by the squeegee on the stencil, the physical stress applied to the paste causes the viscosity to drop, allowing the paste to flow easily through the apertures on the stencil. When the stress on the paste is removed, it regains its viscosity, preventing it from flowing on the circuit board.

3. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   Insufficient solder paste may cause poor bonds and contact between components and the board. The common causes of insufficient solder paste are poor gasketing, clogged stencil apertures, insufficient solder paste bead size, paste/stencil being used beyond recommended life span, stencil not wiped clean, or low squeegee pressure.

4. Squeegee - Wikipedia

   en.wikipedia.org/wiki/Squeegee

   Squeegees with hard rubber or metal blades are used in stencil printing to apply solder paste to printed circuit boards (PCBs). [ 34 ] Small, hand-held plastic and rubber wedges with an edge formed as a blade are used in signwriting for the application of vinyl sheeting to decrease the possibility of air pockets.

5. Graping - Wikipedia

   en.wikipedia.org/wiki/Graping

   The graping phenomenon can be resolved utilizing proper solder materials in addition to correct reflow profile settings. Solder powders are available that provide a tighter distribution range as well as a high oxidation barrier. This barrier not only improves the paste release from the stencil, but also provides an ideal surface area-to-volume ...

6. Thick-film technology - Wikipedia

   en.wikipedia.org/wiki/Thick-film_technology

   Screen-printing is the process of transferring an ink through a patterned woven mesh screen or stencil using a squeegee. [8] For improving accuracy, increasing integration density and improving line and space accuracy of traditional screen-printing photoimageable thick-film technology has been developed. Use of these materials however changes ...

7. Screen printing - Wikipedia

   en.wikipedia.org/wiki/Screen_printing

   Screen printing is a printing technique where a mesh is used to transfer ink (or dye) onto a substrate, except in areas made impermeable to the ink by a blocking stencil.A blade or squeegee is moved across the screen in a "flood stroke" to fill the open mesh apertures with ink, and a reverse stroke then causes the screen to touch the substrate momentarily along a line of contact.

8. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Using a stencil for both the balls and the solder paste or flux, Using a BGA "preform" with embedded balls corresponding to the device pattern, or; Using semiautomated or fully automated machinery. For the PS3 and Xbox mentioned above, the time is about 120 minutes if all goes well. [3]

9. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. It can also be applied by a jet-printing mechanism, similar to an inkjet printer .