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LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5 ) and it has 1700 protruding pins to make contact with the pads on the processor.
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
Second-generation mobile Core 2 Duo processor, successor to Merom, and namesake of its generation, the 45 nm successor to the 65 nm Conroe. Penryn, California, a town of about 2,000 and home to a granite quarry. 2005 Penwell CPU Atom CPU integrating technology licensed from Nokia and aimed at smartphones. Part of the 32 nm Saltwell family.
LGA 1151 LGA 1200 LGA 1700: Intel 7, 14 nm, 22 nm, 32 nm 35 W – 91 W 2 /w hyperthreading, 4, 4 /w hyperthreading ... List of Intel processors.
LGA 1700 (Socket V0) LGA 2011 (Socket R) LGA 2011-3 (Socket R3) – note that LGA 2011-3 is incompatible with LGA 2011 and is used for Haswell-E and Broadwell-E Intel Core i7 extreme processors and the Intel X99 chipset. It does, however have the same pin count and design as LGA 2011. Also used for Xeon E5 processors and Intel C612 chipset.
The 100 Series chipsets (codenamed Sunrise Point), for Skylake processors using the LGA 1151 socket, [89] were released in the third quarter of 2015. [90] The 200 Series chipsets (codenamed Union Point) were introduced along with Kaby Lake processors, which also use the LGA 1151 socket; [91] these were released in the first quarter of 2017. [92]
The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.
LGA 1700: DMI 4.0 ×8: January 2022 SRL67 (H0) CM8071504651805 BX80715G6900 $42 Standard power, embedded: Celeron G6900E: 2 (2) 3.0 GHz — 2 × 1.25 MB 4 MB UHD 710 300–1300 MHz 46 W — LGA 1700 DMI 4.0 ×8 January 2022 SRL6Q (H0) CM8071504653807 $44 Low power: Celeron G6900T: 2 (2) 2.8 GHz — 2 × 1.25 MB 4 MB UHD 710 300–1300 MHz 35 W ...