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Heat pipes may also be added to aluminum or copper heat sinks to reduce spreading resistance. Shape – Thermal transfer takes place at the surface of the heat sink. Therefore, heat sinks should be designed to have a large surface area. This goal can be reached by using a large number of fine fins or by increasing the size of the heat sink itself.
The SC, or shading coefficient, is used widely in the evaluation of heat gain through glass and windows. [1] [5] Finally, the SCL, or solar cooling load factor, accounts for the variables associated with solar heat load. These include the global coordinates of the site and the size of the structure. [1] [5]
A heat sink usually consists of a base with one or more flat surfaces and an array of comb or fin-like protrusions to increase the heat sink's surface area contacting the air, and thus increasing the heat dissipation rate. While a heat sink is a static object, a fan often aids a heat sink by providing increased airflow over the heat sink—thus ...
The overall heat transfer coefficient is a measure of the overall ability of a series of conductive and convective barriers to transfer heat. It is commonly applied to the calculation of heat transfer in heat exchangers, but can be applied equally well to other problems.
It is a measure of the rate of heat transfer inside a material and has SI units of m 2 /s. It is an intensive property . Thermal diffusivity is usually denoted by lowercase alpha ( α ), but a , h , κ ( kappa ), [ 2 ] K , [ 3 ] , D , D T {\displaystyle D_{T}} are also used.
The rate of heat flow is the amount of heat that is transferred per unit of time in some material, usually measured in watts (joules per second). Heat is the flow of thermal energy driven by thermal non-equilibrium, so the term 'heat flow' is a redundancy (i.e. a pleonasm ).
A 2008 review paper written by Philips researcher Clemens J. M. Lasance notes that: "Although there is an analogy between heat flow by conduction (Fourier's law) and the flow of an electric current (Ohm’s law), the corresponding physical properties of thermal conductivity and electrical conductivity conspire to make the behavior of heat flow ...
Temperature increase becomes relevant for relatively small-cross-sections wires, where it may affect normal semiconductor behavior. Besides, since the generation of heat is proportional to the frequency of operation for switching circuits, fast computers have larger heat generation than slow ones, an undesired effect for chips manufacturers.