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A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
Printed circuit board manufacturing is the process of manufacturing bare printed circuit boards (PCBs) and populating them with electronic components. It involves the full assembly of a board into a functional circuit board. In board manufacturing, multiple PCBs are grouped on a single panel for efficient processing.
Material selection is a step in the process of designing any physical object. In the context of product design, the main goal of material selection is to minimize cost while meeting product performance goals. [1] Systematic selection of the best material for a given application begins with properties and costs of candidate materials.
Susceptibility to pad cratering can be impacted by several factors such as: PCB thickness, PCB laminate material properties, component size and stiffness, component location, and solder alloy selection among other factors. [2] [3] [4]
There are several design considerations and mitigation techniques that can be used to reduce the susceptibility to CAF. Certain material selection (i.e. laminate) and design rules (i.e. via spacing) can help reduce CAF risk. Poor adhesion between the resin and glass fibers in the PCB can create a path for CAF to occur.
Coating material (after curing) should have a thickness of 30–130 μm (0.0012–0.0051 in) when using acrylic resin, epoxy resin, or urethane resin. For silicone resin, the coating thickness recommended by the IPC standards is 50–210 μm (0.0020–0.0083 in).
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