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Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
Excluding the continuous strip plating industry, copper is the second most commonly-plated metal after nickel. [6] Copper electroplating offers a number of advantages over other plating processes, including low metal cost, high-conductivity and high-ductility bright finish, and high plating efficiency.
Cupronickel or copper–nickel (CuNi) is an alloy of copper with nickel, usually along with small quantities of other metals added for strength, such as iron and manganese. The copper content typically varies from 60 to 90 percent. (Monel is a nickel–copper alloy that contains a minimum of 52 percent nickel.)
Electroplating of acid gold on underlying copper- or nickel-plated circuits reduces contact resistance as well as surface hardness. Copper-plated areas of mild steel act as a mask if case-hardening of such areas are not desired. Tin-plated steel is chromium-plated to prevent dulling of the surface due to oxidation of tin.
With direct gold-on-copper plating, the copper atoms have the tendency to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide/sulfide layer. Therefore, a layer of a suitable barrier metal, usually nickel, has to be deposited on the copper substrate, forming a copper-nickel-gold sandwich.
Black nickel plating was developed around 1905, and between the two wars, black chrome plating (first German patent 1929.GP 607, 420), which saw wider use only from the mid-1950s. [14] After the First World War, the first procedures for anodic oxidation and coloring of anodically oxidized aluminium were developed (1923, 1924.DRP. 413876).
Electroless nickel plating uses nickel salts as the metal cation source and either hypophosphite (H 2 PO 2 −) (or a borohydride-like compound) as a reducer. [6] A side reaction forms elemental phosphorus (or boron) which is incorporated in the coating. The classical deposition methods follows the following steps:
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.
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