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In 2006, X-Fab merged with 1st Silicon, a semiconductor fabrication plant located in Sarawak, Malaysia. The Sarawak government acquired 35% of X-Fab shares in the merger. [5] In 2007, X-Fab acquired the foundry business from ZMD, thus enabling ZMD to focus on its core business of design and developing analog mixed signal devices. [6]
This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...
Silterra Malaysia Sdn. Bhd. is a Malaysian semiconductor manufacturer founded in November 1995. [ 1 ] [ 5 ] Silterra Malaysia Sdn. Bhd. was formerly known as Wafer Technology (Malaysia) Sdn. Bhd. and changed its name to Silterra Malaysia Sdn. Bhd. in December 1999. [ 6 ]
KUALA LUMPUR (Reuters) -Malaysia is targeting at least 500 billion ringgit ($107 billion) in investment for its semiconductor industry, Prime Minister Anwar Ibrahim said on Tuesday, as the ...
Malaysia aims to attract at least 500 billion ringgit ($107 billion) in investments for its semiconductor sector, Prime Minister Anwar Ibrahim has reportedly said. The planned investments are ...
In September 2006, 1st Silicon completed merger with Germany-based X-Fab Silicon Foundries, to form X-Fab Sarawak Sdn Bhd where X-Fab holds 58% of the shares and Sarawak government holds 35% minority stake. [10] Meanwhile, all 1st Silicon outstanding debt will be borne by the government of Sarawak. [11]
Infineon in 2023 acted on an expansion plan by investing EUR 5 billion into its semiconductor fab in Kulim, Kedah, Malaysia. [39] As of 2023 Infineon was also planning to build two additional plants in Dresden for €5 billion, asking the government to subsidize it with €1 billion, financed through the €4 billion European Chips Act. It ...
ASE provides semiconductor assembly and testing services for over 90 percent of electronics companies in the world. [10] The packaging services include fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip , 2.5D and 3D packaging, system in package (SiP) and copper wire bonding .