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PCI Express 2.1 (with its specification dated 4 March 2009) supports a large proportion of the management, support, and troubleshooting systems planned for full implementation in PCI Express 3.0. However, the speed is the same as PCI Express 2.0.
CFexpress Type A: 20 mm × 28 mm × 2.8 mm, PCIe 3.0 x1 (1.0 GB ... High-capacity, high-speed standard using PCIe as interface Universal Flash Storage Card Extensions
PCI Express 3.0 (×8 link) [n] 64 Gbit/s: 7.88 GB/s: 2011 PCI Express 2.0 (×16 link) [n] 80 Gbit/s: 8 GB/s: 2007 RapidIO Gen2 16x: 80 Gbit/s: 10 GB/s: PCI Express 5.0 (×4 link) 128 Gbit/s: 15.75 GB/s: 2019 PCI Express 3.0 (×16 link) [n] 128 Gbit/s: 15.75 GB/s: 2011 CAPI: 128 Gbit/s: 15.75 GB/s: 2014 QPI (4.80GT/s, 2.40 GHz) 153.6 Gbit/s: 19. ...
The specification would be based on the PCI Express interface and NVM Express protocol. On 18 April 2017 the CompactFlash Association published the CFexpress 1.0 specification. [ 2 ] Version 1.0 will use the XQD form-factor (38.5 mm × 29.8 mm × 3.8 mm) with two PCIe 3.0 lanes for speeds up to 2 GB/s.
Originally developed by the Personal Computer Memory Card International Association (), the ExpressCard standard is maintained by the USB Implementers Forum ().The host device supports PCI Express, USB 2.0 (including Hi-Speed), and USB 3.0 (SuperSpeed) [2] (ExpressCard 2.0 only) connectivity through the ExpressCard slot; cards can be designed to use any of these modes.
Mobile PCI Express Module (MXM) is an interconnect standard for GPUs (MXM Graphics Modules) in laptops using PCI Express created by MXM-SIG. The goal was to create a non-proprietary, industry standard socket, so one could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades.
It has produced the PCI, PCI-X and PCI Express specifications. As of 2024, the board of directors of the PCI-SIG has representatives from: AMD, ARM, Dell EMC, IBM, Intel, Synopsys, Keysight, NVIDIA, and Qualcomm. The chairman and president of the PCI-SIG is Al Yanes, a "Distinguished Engineer" from IBM.
The PCI-X standard was developed jointly by IBM, HP, and Compaq and submitted for approval in 1998. It was an effort to codify proprietary server extensions to the PCI local bus to address several shortcomings in PCI, and increase performance of high bandwidth devices, such as Gigabit Ethernet, Fibre Channel, and Ultra3 SCSI cards, and allow processors to be interconnected in clusters.
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