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Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
With hypophosphite, the main reaction that produces the nickel plating yields orthophosphite H 2 PO − 3, elemental phosphorus, protons H + and molecular hydrogen H 2: [1] 2 Ni 2+ + 8 H 2 PO − 2 + 2 H 2 O → 2 Ni 0 (s) + 6 H 2 PO − 3 + 2 H + + 2 P (s) + 3 H 2 (g) This reaction is catalyzed by some metals including cobalt, palladium ...
Electroless nickel plating uses nickel salts as the metal cation source and either hypophosphite (H 2 PO 2 −) (or a borohydride-like compound) as a reducer. [6] A side reaction forms elemental phosphorus (or boron) which is incorporated in the coating. The classical deposition methods follows the following steps:
Palladium (sometimes alloyed with nickel) is or can be used for component and connector plating in consumer electronics [52] [53] and in soldering materials. The electronic sector consumed 33 tonnes (1.07 million troy ounces) of palladium in 2006, according to a Johnson Matthey report. [54]
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Palladium is found as a free metal and alloyed with platinum and gold with platinum group metals in placer deposits of the Ural Mountains of Eurasia, Australia, Ethiopia, South and North America. However it is commercially produced from nickel-copper deposits found in South Africa and Ontario, Canada. The huge volume of nickel-copper ore ...
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
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