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  2. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.

  4. Thermal adhesive - Wikipedia

    en.wikipedia.org/wiki/Thermal_adhesive

    Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.

  5. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  6. Joint compound - Wikipedia

    en.wikipedia.org/wiki/Joint_compound

    Kitchen renovation spackling to cover holes and tape between sheetrock boards Drywall with joint compound applied.. Joint compound (also known as drywall compound, drywall mud, joint cement or mastic) is a white powder of primarily gypsum dust mixed with water to form a paste the consistency of cake frosting, which is spread onto drywall and sanded when dry to create a seamless base for paint ...

  7. Thermally conductive pad - Wikipedia

    en.wikipedia.org/wiki/Thermally_conductive_pad

    In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

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  9. Hot-melt adhesive - Wikipedia

    en.wikipedia.org/wiki/Hot-melt_adhesive

    A hot glue gun loaded with a glue stick. Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun.

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