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With direct gold-on-copper plating, the copper atoms tend to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide and/or sulphide layer. A layer of a suitable barrier metal , usually nickel , is often deposited on the copper substrate before the gold plating.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.
With direct gold-on-copper plating, the copper atoms have the tendency to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide/sulfide layer. Therefore, a layer of a suitable barrier metal, usually nickel, has to be deposited on the copper substrate, forming a copper-nickel-gold sandwich.
Nickel plating Soon after, John Wright of Birmingham , England discovered that potassium cyanide was a suitable electrolyte for gold and silver electroplating. Wright's associates, George Elkington and Henry Elkington were awarded the first patents for electroplating in 1840.
Sometimes, the most simple designs are the greatest show-stoppers. Hypoallergenic, nickel- and lead-free, these hoops are plated in 14k gold and are eye-catching without being overdone.
Electroless nickel plating uses nickel salts as the metal cation source and either hypophosphite (H 2 PO 2 −) (or a borohydride-like compound) as a reducer. [6] A side reaction forms elemental phosphorus (or boron) which is incorporated in the coating. The classical deposition methods follows the following steps:
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