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  2. Aluminium fluoride - Wikipedia

    en.wikipedia.org/wiki/Aluminium_fluoride

    Only micromolar concentrations of aluminium are needed to form aluminium fluoride. [22] Human exposure to aluminium fluoride can occur in an industrial setting, such as emissions from aluminium reduction processes, [23] or when a person ingests both a fluoride source (e.g., fluoride in drinking water or residue of fluoride-based pesticides) and ...

  3. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

  4. Fluorine compounds - Wikipedia

    en.wikipedia.org/wiki/Fluorine_compounds

    Sodium fluoride: yellow is fluorine, purple is sodium. They are isoelectronic, but fluorine is bigger because its nuclear charge is lower. The alkali metals form monofluorides. All are soluble and have the sodium chloride (rock salt) structure, [47] Because the fluoride anion is basic, many alkali metal fluorides form bifluorides with the ...

  5. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

  6. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

  7. Adhesive - Wikipedia

    en.wikipedia.org/wiki/Adhesive

    The bond has strength because the adhesive is hard enough to resist flow when stress is applied to the bond. Once the adhesive and the adherend are in close proximity, molecular interactions, such as van der Waals forces, become involved in the bond, contributing significantly to its ultimate strength.

  8. Glass ionomer cement - Wikipedia

    en.wikipedia.org/wiki/Glass_ionomer_cement

    Glass ionomer cements act as sealants when pits and fissures in the tooth occur and release fluoride to prevent further enamel demineralisation and promote remineralisation. Fluoride can also hinder bacterial growth, by inhibiting their metabolism of ingested sugars in the diet. It does this by inhibiting various metabolic enzymes within the ...

  9. Aluminium joining - Wikipedia

    en.wikipedia.org/wiki/Aluminium_joining

    Aluminium alloys are often used due to their high strength-to-weight ratio, corrosion resistance, low cost, high thermal and electrical conductivity.There are a variety of techniques to join aluminium including mechanical fasteners, welding, adhesive bonding, brazing, soldering and friction stir welding (FSW), etc. Various techniques are used based on the cost and strength required for the joint.

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