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Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre-scale or smaller. These devices are typically made from semiconductor materials. Many components of a ...
Microfabrication technologies originate from the microelectronics industry, and the devices are usually made on silicon wafers even though glass, plastics and many other substrate are in use.
Nanoelectronics refers to the use of nanotechnology in electronic components. The term covers a diverse set of devices and materials, with the common characteristic that they are so small that inter-atomic interactions and quantum mechanical properties need to be studied extensively.
A compound semiconductor is a semiconductor compound composed of chemical elements of at least two different species. These semiconductors form for example in periodic table groups 13–15 (old groups III–V), for example of elements from the Boron group (old group III, boron, aluminium, gallium, indium) and from group 15 (old group V, nitrogen, phosphorus, arsenic, antimony, bismuth).
The insulating material has traditionally been a form of SiO 2 or a silicate glass, but recently new low dielectric constant materials, also called low-κ dielectrics, are being used (such as silicon oxycarbide), typically providing dielectric constants around 2.7 (compared to 3.82 for SiO 2), although materials with constants as low as 2.2 are ...
technology node – an industry standard semiconductor manufacturing process generation defined by the minimum size of the transistor gate length thermocompression bonding – a bonding technique where two metal surfaces are brought into contact with simultaneous application of force and heat
MEMS microcantilever resonating inside a scanning electron microscope Proposal submitted to DARPA in 1986 first introducing the term "microelectromechanical systems". MEMS (micro-electromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts.
Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.