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LGA 775 (land grid array 775), also known as Socket T, is an Intel desktop CPU socket.Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the underside of the processor (CPU).
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.
LGA 775 Socket T: 65 nm, 90 nm, 130 nm, 180 nm 21 W – 115 W 1 /w hyperthreading ... List of Intel processors. List of Intel Atom processors;
Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
Intel Atom Processor E3800 Product Family and Intel Celeron Processor N2807/N2930/J1900 [3] The San Francisco Bay Trail, which is located a few miles from Intel HQ in Santa Clara, CA. 2014 Bear Canyon Motherboard Intel D945GBO motherboard. Micro-BTX form factor, Socket T , 945G chipset . Reference unknown. 2006 Bearlake: Chipset
Intel Family 15 Model 3; Model SL7E4 has an unattached fan heatsink. Some Socket 478 models supports loadline B (FMB1.0) with reduced TDP to 89 Watts (100.39 Watts peak) [19] Some LGA775 models supports Prescott FMB1 (775_VR_CONFIG_04A) with reduced TDP to 85 Watts (100.78 Watts peak) Transistors: 125 million; Die size: 112 mm 2; Steppings: C0 ...
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...
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