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This is a list of causal mapping software. Causal mapping software enables users to create and/or work with causal maps: qualitative networks of interconnected nodes in which each connection represents a causal link. Software and services for concept mapping can also be used for causal mapping if they allow the creation of directed links.
The STAAD.Pro Advanced Slab Design workflow is an integrated tool that works from within the STAAD.Pro environment. Concrete slabs can be defined, and the data can be transferred to RAM Concept. The data passed into RAM Concept includes the geometry, section and material properties, loads and combination information, and analysis results.
EAGLE is a scriptable electronic design automation (EDA) application with schematic capture, printed circuit board (PCB) layout, auto-router and computer-aided manufacturing (CAM) features.
Dia has special objects to help draw entity-relationship models, Unified Modeling Language (UML) diagrams, flowcharts, network diagrams, and simple electrical circuits. It is also possible to add support for new shapes by writing simple XML files, using a subset of Scalable Vector Graphics (SVG) to draw the shape.
Command-line tools, Embeddable in web pages, Eclipse: Input or export can be by diagram or Umple textual form, separation of concerns (aspects, traits, mixins), embeds action code in Java and other languages, written in itself, documentation generation, plugin architecture for generators WhiteStarUML: Yes Yes Import Yes Java 1.5, C#, C++, SQL
RELAP5-3D is an outgrowth of the one-dimensional RELAP5/MOD3 code developed at Idaho National Laboratory (INL) for the U.S. Nuclear Regulatory Commission (NRC). The U.S. Department of Energy (DOE) began sponsoring additional RELAP5 development in the early 1980s to meet its own reactor safety assessment needs.
Name Underlying data model Full and Latest SysML support Full and Latest UML support XMI Automated document generation OSLC support Can be integrated with Astah: Yes Partial ...
The most basic design rules are shown in the diagram on the right. The first are single layer rules. A width rule specifies the minimum width of any shape in the design. A spacing rule specifies the minimum distance between two adjacent objects. These rules will exist for each layer of semiconductor manufacturing process, with the lowest layers ...
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