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  2. Milling cutter - Wikipedia

    en.wikipedia.org/wiki/Milling_cutter

    The tooth cuts the material, and chips of this material are pulled up the flute by the rotation of the cutter. There is almost always one tooth per flute, but some cutters have two teeth per flute. [1] Often, the words flute and tooth are used interchangeably. Milling cutters may have from one to many teeth, with two, three and four being most ...

  3. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Semiconductor device fabrication. Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM). It is a multiple-step photolithographic and physico-chemical process (with steps such as ...

  4. List of semiconductor scale examples - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    Processors using 130 nm manufacturing technology. Fujitsu SPARC64 V – 2001 [102] Gekko by IBM and Nintendo (GameCube console) – 2001. Motorola PowerPC 7447 and 7457 – 2002. IBM PowerPC G5 970 – October 2002 – June 2003. Intel Pentium III Tualatin and Coppermine – 2001-04. Intel Celeron Tualatin -256 – 2001-10-02.

  5. Speeds and feeds - Wikipedia

    en.wikipedia.org/wiki/Speeds_and_feeds

    Cutting speed may be defined as the rate at the workpiece surface, irrespective of the machining operation used. A cutting speed for mild steel of 100 ft/min is the same whether it is the speed of the cutter passing over the workpiece, such as in a turning operation, or the speed of the cutter moving past a workpiece, such as in a milling operation.

  6. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    The size of wafers for photovoltaics is 100–200 mm square and the thickness is 100–500 μm. [10] Electronics use wafer sizes from 100 to 450 mm diameter. The largest wafers made have a diameter of 450 mm, [ 11 ] but are not yet in general use.

  7. Die (integrated circuit) - Wikipedia

    en.wikipedia.org/wiki/Die_(integrated_circuit)

    A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography.

  8. Chip formation - Wikipedia

    en.wikipedia.org/wiki/Chip_formation

    Chip formation is part of the process of cutting materials by mechanical means, using tools such as saws, lathes and milling cutters.. The formal study of chip formation was encouraged around World War II and shortly afterwards, with increases in the use of faster and more powerful cutting machines, particularly for metal cutting with the new high speed steel cutters.

  9. Drill bit - Wikipedia

    en.wikipedia.org/wiki/Drill_bit

    Drill bit. From top: Spade, brad point, masonry, and twist drills bits. Drill bit (upper left), mounted on a pistol-grip electric drill. A set of masonry drills. A drill bit is a cutting tool used in a drill to remove material to create holes, almost always of circular cross-section. Drill bits come in many sizes and shapes and can create ...