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When overheating, the temperature of the part rises above the operating temperature. Overheating can take place: if heat is produced in more than expected amount (such as in cases of short-circuits, or applying more voltage than rated), or; if heat dissipation is poor, so that normally produced waste heat does not drain away properly.
Thermal switches on microprocessors often stop only the fetching of instructions to execute, reducing the clock rate to zero until a lower temperature is reached, while maintaining power to the cache to prevent data loss (although a second switch, with a higher triggering temperature, usually turns off even the cache and forces the computer to ...
Evaporation, especially for 2-phase coolants, can pose a problem, [18] and the liquid may require either to be regularly refilled or sealed inside the computer's enclosure. Immersion cooling can allow for extremely low PUE values of 1.05, vs air cooling's 1.35, and allow for up to 100 KW of computing power (heat dissipation, TDP) per 19-inch ...
A fan-cooled heat sink on the processor of a personal computer. To the right is a smaller heat sink cooling another integrated circuit of the motherboard. Typical heatsink-fan combination found on a consumer laptop.
A North American power strip with two USB power ports that includes a built in surge protector. A power strip (also known as a multi-socket, power board and many other variations [a]) is a block of electrical sockets that attaches to the end of a flexible cable (typically with a mains plug on the other end), allowing multiple electrical devices to be powered from a single electrical socket.
Processor manufacturers usually release two power consumption numbers for a CPU: typical thermal power, which is measured under normal load (for instance, AMD's average CPU power) maximum thermal power, which is measured under a worst-case load; For example, the Pentium 4 2.8 GHz has a 68.4 W typical thermal power and 85 W maximum thermal power.
This usage implies a lack of computer savviness, asserting that problems arising when using a device are the fault of the user. Critics of the term argue that many problems are caused instead by poor product designs that fail to anticipate the capabilities and needs of the user. The term can also be used for non-computer-related mistakes.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).