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2. Potting (electronics) - Wikipedia

   en.wikipedia.org/wiki/Potting_(electronics)

   The mold may be part of the finished article and may provide shielding or heat dissipating functions in addition to acting as a mold. When the mold is removed the potted assembly is described as cast. [4] As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5]

3. Precision glass moulding - Wikipedia

   en.wikipedia.org/wiki/Precision_glass_moulding

   Precision glass moulding can be used to produce a large variety of optical form elements such as spheres, aspheres, free-form elements and array-structures. Concerning the curvature of the lens elements, the following statements can be drawn: Acceptable lens shapes are most bi-convex , plano-convex and mild meniscus shapes.

4. Compression molding - Wikipedia

   en.wikipedia.org/wiki/Compression_molding

   Compression molding is a method of molding in which the molding material, generally preheated, is first placed in an open, heated mold cavity. The mold is closed with a top force or plug member, pressure is applied to force the material into contact with all mold areas, while heat and pressure are maintained until the molding material has cured; this process is known as compression molding ...

5. Ceramic mold casting - Wikipedia

   en.wikipedia.org/wiki/Ceramic_mold_casting

   Ceramic mold casting, also known ambiguously as ceramic molding, [1] is a group of metal casting processes that use ceramics as the mold material. It is a combination of plaster mold casting and investment casting. [2] [3] There are two types of ceramic mold casting: the Shaw process and the Unicast process. [4]

6. Sheet moulding compound - Wikipedia

   en.wikipedia.org/wiki/Sheet_moulding_compound

   Once these have drifted through the depth of resin paste, another sheet is added on top which sandwiches the glass. The sheets are compacted and then enter onto a take-up roll, which is used to store the product whilst it matures. The carrier film is then later removed and the material is cut into charges.

7. Bulk moulding compound - Wikipedia

   en.wikipedia.org/wiki/Bulk_moulding_compound

   The mixing is done at room temperature and stored at low temperatures to slow down curing prior to molding. The concentration of the mixture can vary depending on application, but is typically 30% glass fibers, 25% filler, and 45% resin, styrene, and initiator. [2] The material is provided in bulk or in logs approximately 4" in diameter.