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2. Power electronic substrate - Wikipedia

   en.wikipedia.org/wiki/Power_electronic_substrate

   This is also true for low-power applications (from some milliwatts to some watts), as the PCB can be thermally enhanced by using thermal vias or wide tracks to improve convection. An advantage of this method is that multilayer PCB allows design of complex circuits, whereas DBC and IMS are mostly single-sided technologies. [8]

3. Printed circuit board - Wikipedia

   en.wikipedia.org/wiki/Printed_circuit_board

   Not to be confused with Printed electronics. "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and ...

4. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Clearance between package body and PCB. H Height of package from pin tip to top of package. T Thickness of pin. L Length of package body only. L W Pin width. L L Pin length from package to pin tip. P Pin pitch (distance between conductors to the PCB). W B Width of the package body only. W L Length from pin tip to pin tip on the opposite side.

5. These Affordable Bar Stools From Wayfair Will Transform Your ...

   www.aol.com/lifestyle/affordable-bar-stools...

   We compiled the best bar stools to buy online, including counter-height stools with backs, swivel stools for kitchen islands and modern styles for small spaces.

6. Comparison of single-board microcontrollers - Wikipedia

   en.wikipedia.org/wiki/Comparison_of_single-board...

   Femtoduino PCB vs Dime An ultra-small (20.7x15.2 mm) Arduino compatible board designed by Fabio Varesano. Femtoduino is currently the smallest Arduino compatible board available. [citation needed] Freeduino USB Mega 2560 [162] Bhasha Technologies [163] ATmega2560 [25]

7. Microvia - Wikipedia

   en.wikipedia.org/wiki/Microvia

   With the advent of smartphones and other hand-held electronic devices, microvias have evolved from single-level to stacked microvias that cross over multiple HDI layers. Sequential build-up (SBU) technology is used to fabricate HDI boards. The HDI layers are usually built up from a traditionally manufactured double-sided core board or ...