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A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.
The cross-cut test is a method for determining the resistance of paints and coatings to separation from substrates by utilizing a tool to cut a right-angle lattice pattern into the coating, penetrating to the substrate. A quick pass/fail test can be accomplished through this method.
Most common are "jerk testing" by modified drop test procedures or use of the constant pull rates of a universal testing machine. Other procedures use a static force by hanging a heavily loaded package for an extended time or even using a centrifuge .
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The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and ...
Delamination of carbon fiber–reinforced polymer under compression load. Delamination is a mode of failure where a material fractures into layers. A variety of materials, including laminate composites [1] and concrete, can fail by delamination.
Dye-n-Pry, also called Dye And Pry, Dye and Pull, Dye Staining, or Dye Penetrant, is a destructive analysis technique used on surface mount technology (SMT) components to either perform failure analysis or inspect for solder joint integrity. It is an application of dye penetrant inspection.
USB Tweezers performing cold bump pull (CPB) on a bond tester. Measuring bond strength by pull testing is often the best way to get the failure mode in which you are interested. Additionally, and unlike a shear test, as the bond separates, the fracture surfaces are pulled away from each other, cleanly enabling accurate failure mode analysis.