Search results
Results from the WOW.Com Content Network
An organ-on-a-chip (OOC) is a multi-channel 3-D microfluidic cell culture, integrated circuit (chip) that simulates the activities, mechanics and physiological response of an entire organ or an organ system. [1] [2] It constitutes the subject matter of significant biomedical engineering research, more precisely in bio-MEMS.
On–off keying (OOK) denotes the simplest form of amplitude-shift keying (ASK) modulation that represents digital data as the presence or absence of a carrier wave. [1] In its simplest form, the presence of a carrier for a specific duration represents a binary one, while its absence for the same duration represents a binary zero.
OC-3c (c stands for "concatenated") concatenates three STS-1 (OC-1) frames into a single OC-3 look alike stream. The three STS-1 (OC-1) streams interleave with each other so that the first column is from the first stream, the second column is from the second stream, and the third is from the third stream.
IC – Interior Communications Electrician [1] ICO – In Case Of (or In Care Of / In Concern Of) ... OOC – Out of Calibration or Out of Compliance [14]
CAD: computer-aided design, computer-aided drafting; cadmium [plating]: CAGE: Commercial and Government Entity [code]: A CAGE code is a unique identifier to label an entity (that is, a specific government agency or corporation at a specific site) that is a CDA, ODA, or MFR of the part defined by the drawing.
Interstitial cystitis is a chronic bladder condition that can cause pelvic pressure and pain. Lifestyle changes, medication, and surgery can treat IC. What is interstitial cystitis and why you ...
Occasionally connected computing is a software architecture based on the idea that an end user should be able to continue working with an internet application even when temporarily disconnected or when a wireless connection fails or is otherwise unavailable.
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.