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Layout view of a simple CMOS operational amplifier. In integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit.
octal 2-input multiplexer, latch, glitch-free three-state 28 SN74LS606: 74x607 1 octal 2-input multiplexer, latch, glitch-free open-collector 28 SN74LS607: 74x608 1 memory cycle controller 16 SN74LS608: 74x610 1 memory mapper, latched three-state 40 SN74LS610: 74x611 1 memory mapper, latched open-collector 40 SN74LS611: 74x612 1 memory mapper ...
The layout versus schematic (LVS) is the class of electronic design automation (EDA) verification software that determines whether a particular integrated circuit layout corresponds to the original schematic or circuit diagram of the design.
Engineer using an early IC-designing workstation to analyze a section of a circuit design cut on rubylith, circa 1979. Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs
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Open collector, open drain, open emitter, and open source refer to integrated circuit (IC) output pin configurations that process the IC's internal function through a transistor with an exposed terminal that is internally unconnected (i.e. "open").
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, [1] [2] so that they behave as a single device to achieve performance ...
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.