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Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm. Quad flat package (QFP): various sizes, with pins on all four sides. Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins.
Contents. Small outline integrated circuit. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Appearance. A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the ...
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the ...
ARINC had installed computer data networks in police cars and railroad cars and also maintains the standards for line-replaceable units. ARINC was formerly headquartered in Annapolis, Maryland , and had two regional headquarters in London , established in 1999 to serve the Europe, Middle East, and Africa region, and Singapore , established in ...
JEDEC. The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in the United States. JEDEC has over 300 members, including some of the world's largest computer companies. Its scope and past activities includes standardization of part numbers, defining an ...
Testing modified atmosphere in a plastic bag of carrots. Food packaging is a packaging system specifically designed for food and represents one of the most important aspects among the processes involved in the food industry, as it provides protection from chemical, biological and physical alterations. [1]
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