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TGA – Thermogravimetric analysis; TIKA – Transmitting ion kinetic analysis; TIMS – Thermal ionization mass spectrometry; TIRFM – Total internal reflection fluorescence microscopy; TLS – Photothermal lens spectroscopy, a type of photothermal spectroscopy; TMA – Thermomechanical analysis; TOF-MS – Time-of-flight mass spectrometry
A Hanford scientist uses an Auger electron spectrometer to determine the elemental composition of surfaces.. Auger electron spectroscopy (AES; pronounced in French) is a common analytical technique used specifically in the study of surfaces and, more generally, in the area of materials science.
Characterization, when used in materials science, refers to the broad and general process by which a material's structure and properties are probed and measured. It is a fundamental process in the field of materials science, without which no scientific understanding of engineering materials could be ascertained.
IsGISAXS (grazing incidence small angle X-ray scattering) is a software program dedicated to the simulation and analysis of GISAXS from nanostructures. IsGISAXS only encompasses the scattering by nanometric sized particles, which are buried in a matrix subsurface or supported on a substrate or buried in a thin layer on a substrate.
Small-angle X-ray scattering (SAXS) is a small-angle scattering technique by which nanoscale density differences in a sample can be quantified. This means that it can determine nanoparticle size distributions, resolve the size and shape of (monodisperse) macromolecules, determine pore sizes and characteristic distances of partially ordered materials. [1]
Rutherford backscattering spectrometry (RBS) is an analytical technique used in materials science.Sometimes referred to as high-energy ion scattering (HEIS) spectrometry, RBS is used to determine the structure and composition of materials by measuring the backscattering of a beam of high energy ions (typically protons or alpha particles) impinging on a sample.
Redeposition of sputtered material on the substrate can also give problems, especially at high sputtering pressures. Sputtering of the surface of a compound or alloy material can result in the surface composition being changed. Often the species with the least mass or the highest vapor pressure is the one preferentially sputtered from the surface.
Metal substrates for use in SAMs can be produced through physical vapor deposition techniques, electrodeposition or electroless deposition. [1] Thiol or selenium SAMs produced by adsorption from solution are typically made by immersing a substrate into a dilute solution of alkane thiol in ethanol, though many different solvents can be used [1] besides use of pure liquids. [16]