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  2. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.

  3. Conductive polymer - Wikipedia

    en.wikipedia.org/wiki/Conductive_polymer

    The conductivity of such polymers is the result of several processes. For example, in traditional polymers such as polyethylenes, the valence electrons are bound in sp 3 hybridized covalent bonds. Such "sigma-bonding electrons" have low mobility and do not contribute to the electrical conductivity of the material.

  4. Chemistry of pressure-sensitive adhesives - Wikipedia

    en.wikipedia.org/wiki/Chemistry_of_pressure...

    Pressure sensitive adhesives are viscoelastic polymers with their rheology tuned to the desired bonding and de-bonding characteristics needed. [5] Typical materials used to make the adhesive include: acrylate polymer, [6] rubber, either natural rubber or synthetic thermoplastic elastomer [7] silicone rubber; and others

  5. Siloxane - Wikipedia

    en.wikipedia.org/wiki/Siloxane

    It can be appreciated that the siloxanes would have low barriers for rotation about the Si−O bonds as a consequence of low steric hindrance. This geometric consideration is the basis of the useful properties of some siloxane-containing materials, such as their low glass transition temperatures .

  6. Silicone - Wikipedia

    en.wikipedia.org/wiki/Silicone

    Silicone caulk can be used as a basic sealant against water and air penetration. In organosilicon and polymer chemistry, a silicone or polysiloxane is a polymer composed of repeating units of siloxane (−O−R 2 Si−O−SiR 2 −, where R = organic group). They are typically colorless oils or rubber-like substances. Silicones are used in ...

  7. Solvent bonding - Wikipedia

    en.wikipedia.org/wiki/Solvent_bonding

    Solvent bonding differs from adhesive bonding, because the solvent does not become a permanent addition to the joined substrate. [4] Solvent bonding differs from other plastic welding processes in that heating energy is generated by the chemical reaction between the solvent and thermoplastic, and cooling occurs during evaporation of the solvent ...

  8. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

  9. Silanization - Wikipedia

    en.wikipedia.org/wiki/Silanization

    Silanization (or siliconization) of glassware is a common application that increases the hydrophobicity of a glass container. Thus treated, the glassware produces a flat meniscus and allowing for more complete transfer of aqueous solutions. [2] [8] Silanization of glassware is used in cell culturing to minimize adherence of cells to flask walls ...

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