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A 16GB [1] DDR4 SO-DIMM module by Micron. DDR4 memory is supplied in 288-pin dual in-line memory modules (DIMMs), similar in size to 240-pin DDR3 DIMMs. DDR4 RAM modules feature pins that are spaced more closely at 0.85 mm compared to the 1.0 mm spacing in DDR3, allowing for a higher pin density within the same standard DIMM length of 133.35 mm ...
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
RAM Graphics Storage Screen Weight Size (in) Resolution Model Cores GHz HP ProBook 440 G9 Intel Core i7-1255U 10 3.5 16 GB Intel Iris Xe Graphics 512 SSD 14 1920 x 1080 1.36 ProBook 450 G9 Intel Core i5-1235U 3.3 8 GB Intel Iris Xe Graphics 15.6 1.74 ProBook 455 G9 AMD Ryzen 7 5825U 8 2 16 GB AMD Radeon Graphics ProBook x360 435 G9 AMD Ryzen 5 ...
Historical lowest retail price of computer memory and storage Electromechanical memory used in the IBM 602, an early punch multiplying calculator Detail of the back of a section of ENIAC, showing vacuum tubes Williams tube used as memory in the IAS computer c. 1951 8 GB microSDHC card on top of 8 bytes of magnetic-core memory (1 core is 1 bit.)
DDR4 reached mass market adoption around 2015, which is comparable with the approximately five years taken for DDR3 to achieve mass market transition over DDR2. The DDR4 chips run at 1.2 V or less, [18] [19] compared to the 1.5 V of DDR3 chips, and have in excess of 2 billion data transfers per second.
As with earlier memory generations, faster DDR3 memory became available after the release of the initial versions. DDR3-2000 memory with 9-9-9-28 latency (9 ns) was available in time to coincide with the Intel Core i7 release in late 2008, [ 19 ] while later developments made DDR3-2400 widely available (with CL 9–12 cycles = 7.5–10 ns), and ...
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