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  2. ANSI/ASME Y14.1 - Wikipedia

    en.wikipedia.org/wiki/ANSI/ASME_Y14.1

    A size chart illustrating the ANSI sizes. In 1992, the American National Standards Institute adopted ANSI/ASME Y14.1 Decimal Inch Drawing Sheet Size and Format, [1] which defined a regular series of paper sizes based upon the de facto standard 8 + 1 ⁄ 2 in × 11 in "letter" size to which it assigned the designation "ANSI A".

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), [ 31 ] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in ...

  4. Thin shrink small outline package - Wikipedia

    en.wikipedia.org/wiki/Thin_Shrink_Small_Outline...

    The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count.

  5. Poly(methyl methacrylate) - Wikipedia

    en.wikipedia.org/wiki/Poly(methyl_methacrylate)

    Sheets of PMMA are commonly used in the sign industry to make flat cut out letters in thicknesses typically varying from 3 to 25 millimeters (0.1 to 1.0 in). These letters may be used alone to represent a company's name and/or logo, or they may be a component of illuminated channel letters.

  6. Plastic film - Wikipedia

    en.wikipedia.org/wiki/Plastic_film

    Plastic film is a thin continuous polymeric material. Thicker plastic material is often called a "sheet". Thicker plastic material is often called a "sheet". These thin plastic membranes are used to separate areas or volumes, to hold items, to act as barriers, or as printable surfaces.

  7. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB . [ 1 ] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB).

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