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A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
Many substrates provide a better bonding surface when they are treated at the time they are produced. This is called “pre-treatment.” The effects of corona treatment diminish over time. Therefore, many surfaces will require a second “bump” treatment at the time they are converted to ensure bonding with printing inks, coatings, and ...
While the profile may use certain features of the core specification, specific versions of profiles are rarely tied to specific versions of the core specification, making them independent of each other. For example, there are Hands-Free Profile (HFP) 1.5 implementations using both Bluetooth 2.0 and Bluetooth 1.2 core specifications.
Hands-free computing is important because it is useful to both able and disabled users. Speech recognition systems can be trained to recognize specific commands and upon confirmation of correctness instructions can be given to systems without the use of hands. This may be useful while driving or to an inspector or engineer in a factory environment.
The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit ...
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Sample image of a hand held thermography camera. There is a difference between Medical Thermology as promulgated by medically based organizations such as the American Academy of Thermology (AAT), and thermography as practiced by alternative providers or physicians who overstate the benefits of thermography.
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; [1] in the latter case, they may be referred to as microbumps (μbumps ...