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Intel Core 2 Duo E7500 2.93 GHz installed into LGA 775 socket. The force from the load plate ensures that the processor is completely level, giving the CPU's upper surface optimal contact with the heat sink or cold-water block fixed onto the top of the CPU to carry away the heat generated by the CPU. This socket also introduces a new method of ...
Intel Family 15 Model 3; Model SL7E4 has an unattached fan heatsink. Some Socket 478 models supports loadline B (FMB1.0) with reduced TDP to 89 Watts (100.39 Watts peak) [19] Some LGA775 models supports Prescott FMB1 (775_VR_CONFIG_04A) with reduced TDP to 85 Watts (100.78 Watts peak) Transistors: 125 million; Die size: 112 mm 2; Steppings: C0 ...
Socket 478, also known as mPGA478 or mPGA478B, is a 478-contact CPU socket used for Intel's Pentium 4 and Celeron series CPUs. Socket 478 was launched in August 2001 in advance of the Northwood core to compete with AMD 's 462-pin Socket A and their Athlon XP processors.
Originally, Intel released two Prescott lines on Socket 478: the E-series, with an 800 MT/s FSB and Hyper-Threading support, and the low-end A-series, with a 533 MT/s FSB and Hyper-Threading disabled. LGA 775 Prescott CPUs use a rating system, labeling them as the 5xx series (Celeron Ds are the 3xx series, while Pentium Ms are the 7xx series).
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
A heat sink (aluminum) with its heat pipes (copper) and fan (black) A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of ...
Intel calculates a specified chip's TDP according to the amount of power the computer's fan and heatsink need to be able to dissipate while the chip is under sustained load. Actual power usage can be higher or (much) lower than TDP, but the figure is intended to give guidance to engineers designing cooling solutions for their products. [ 9 ]
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