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Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...
Laser beam machining (LBM) is a form of machining that uses heat directed from a laser beam. This process uses thermal energy to remove material from metallic or nonmetallic surfaces. The high frequency of monochromatic light will fall on the surface, thus heating, melting and vaporizing the material due to the impinge of photons (see Coulomb ...
Laser metal deposition (LMD) is an additive manufacturing process in which a feedstock material (typically a powder) is melted with a laser and then deposited onto a substrate. [1] A variety of pure metals and alloys can be used as the feedstock, as well as composite materials such as metal matrix composites .
Laser ablation or photoablation (also called laser blasting[1][2][3]) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the material is typically converted ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
An SLS machine being used at the Centro de Pesquisas Renato Archer in Brazil.. Selective laser sintering (SLS) is an additive manufacturing (AM) technique that uses a laser as the power and heat source to sinter powdered material (typically nylon or polyamide), aiming the laser automatically at points in space defined by a 3D model, binding the material together to create a solid structure.
Laser drilling is the process of creating thru-holes, referred to as “popped” holes or “percussion drilled” holes, by repeatedly pulsing focused laser energy on a material. The diameter of these holes can be as small as 0.002” (~50 μm). If larger holes are required, the laser is moved around the circumference of the “popped” hole ...
The ruby laser is a three level solid state laser. The active laser medium (laser gain/ amplification medium) is a synthetic ruby rod that is energized through optical pumping, typically by a xenon flashtube. Ruby has very broad and powerful absorption bands in the visual spectrum, at 400 and 550 nm, and a very long fluorescence lifetime of 3 ...
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