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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Electrodes in connectors are usually made of copper alloys, due to their good conductivity and malleability. [7]: 15 Alternatives include brass, phosphor bronze, and beryllium copper. The base electrode metal is often coated with another inert metal such as gold, nickel, or tin. [8]
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
The plastic connector housing is most often white, as shown (TE Connectivity / AMP 171822-4), but black is also common. Other colours are rarer. The part numbers used for the female contact pins depends on the detailed design, the surface coating (for example tinned or gold plated) and the form of supply.
A MIL-DTL-38999 circular connector plated with a nickel–teflon composite. Left: plug (male) type connector; Right: receptacle (female) type connector) Electrical or fiber-optic connectors used by U.S. Department of Defense were originally developed in the 1930s for severe aeronautical and tactical service applications, and the Type "AN" series set the standard for modern military circular ...
The exact gold bars that Costco offers are 1 ounce gold PAMP Suisse Lady Fortuna Versican bars. The one-ounce bars go for just under $2,000, depending on the time of purchase, according to ...
Dumet-wire is a copper clad wire (25% of copper by weight) with a core of nickel-iron alloy 42 (42% of nickel by weight). [10] The core having low CTE makes it possible to produce a wire with a radial CTE lower than a linear CTE of the glass, so that the glass-to-metal interface is under a low compression stress.