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Surface-mount capacitor A MOSFET, placed upon a British postage stamp for size comparison. Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2]
IEC/EN 60384-20—Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors; IEC/EN 60384-23—Fixed metallized polyethylene naphthalate film dielectric chip d.c. capacitors; Electrolytic capacitors. IEC/EN 60384-3—Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte
Surface mount components avoid undesirable high-frequency effects due to the leads and simplify automated assembly, although manual handling is made difficult due to their small size. Mechanically controlled variable capacitors allow the plate spacing to be adjusted, for example by rotating or sliding a set of movable plates into alignment with ...
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).
Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device package with metal end terminals. Diodes and resistors are the most common MELF devices. [1] The EN 140401-803 and JEDEC DO-213 standards describe multiple MELF components. [2]
IEC/EN 60384-3—Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte; IEC/EN 60384-4—Aluminium electrolytic capacitors with solid (MnO 2) and non-solid electrolyte; IEC/EN 60384-18—Fixed aluminum electrolytic surface mount capacitors with solid (MnO 2) and non-solid electrolyte
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