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The cleaner would first inspect the jewelry to ensure that the gemstones are accounted for and secured. Materials that can handle it are often placed in an ultrasonic bath using a cleaning solution and later put through a steam cleaner, while more sensitive materials will go through light brushing in soapy water.
The degree to which the material resists the tendency to flow. The viscosity for a particular paste is available from the manufacturer's catalog; in-house testing is sometimes needed to judge the remaining usability of solder paste after a period of use. Thixotropic index Solder paste is thixotropic, meaning that its viscosity changes with ...
In brazing, one generally uses rods that are touched to the joint while being heated. With silver soldering, small pieces of solder wire are placed onto the metal prior to heating. A flux, often made of boric acid and denatured alcohol, is used to keep the metal and solder clean and to prevent the solder from moving before it melts.
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...
Working in small sections, scrub the grout lines using firm pressure. Rinse frequently with clean water to remove loosened dirt and eraser residue. Continue working in sections until all grout is ...
Lead-free reflow soldering temperatures are higher, which results in more graping. Graping is also caused by increased surface oxidation. The increased surface oxidation is the result of smaller printed paste deposit volumes that cause a diminished surface area to flux ratio of the solder particle, resulting in flux exhaustion.
Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...
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