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  2. Poise (unit) - Wikipedia

    en.wikipedia.org/wiki/Poise_(unit)

    The poise is often used with the metric prefix centi-because the viscosity of water at 20 °C (standard conditions for temperature and pressure) is almost exactly 1 centipoise. [3] A centipoise is one hundredth of a poise, or one millipascal-second (mPa⋅s) in SI units (1 cP = 10 −3 Pa⋅s = 1 mPa⋅s). [4] The CGS symbol for the centipoise ...

  3. Incontinence pad - Wikipedia

    en.wikipedia.org/wiki/Incontinence_pad

    A balanced diet, exercise, hand hygiene, and prompts to go to the toilet should be preferred over using pads. [2] An ethnographic study in the UK pointed out the existence of "pad culture" which means that the main care strategy was the use of continence pads even in cases where people were continent. The main reasons for this strategy were ...

  4. Poise - Wikipedia

    en.wikipedia.org/wiki/Poise

    Poise may mean: Poise (unit), a measure of viscosity; A concept similar to gracefulness; Ferdinand Poise (1828–1892), French composer; See also

  5. Darcy (unit) - Wikipedia

    en.wikipedia.org/wiki/Darcy_(unit)

    A medium with a permeability of 1 darcy permits a flow of 1 cm 3 /s of a fluid with viscosity 1 cP (1 mPa·s) under a pressure gradient of 1 atm/cm acting across an area of 1 cm 2. Typical values of permeability range as high as 100,000 darcys for gravel, to less than 0.01 microdarcy for granite. Sand has a permeability of approximately 1 darcy ...

  6. Viscosity - Wikipedia

    en.wikipedia.org/wiki/Viscosity

    The submultiple centistokes (cSt) is often used instead, 1 cSt = 1 mm 2 ·s −1 = 10 −6 m 2 ·s −1. 1 cSt is 1 cP divided by 1000 kg/m^3, close to the density of water. The kinematic viscosity of water at 20 °C is about 1 cSt.

  7. Thermally conductive pad - Wikipedia

    en.wikipedia.org/wiki/Thermally_conductive_pad

    In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

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