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It is used for spraying pure metal powders with the sizes of 5–50 μm. In low-pressure cold spraying (LPCS), the working gas is a compressed gas with pressure 0.5–1.0 MPa, flow rate 0.5–2 m 3 /min and the heating power 3–5 kW. It is used for spraying a mechanical mixture of metal and ceramic powders.
Spray forming offers certain advantages over both conventional ingot metallurgy and more specialized techniques such as powder metallurgy.Firstly, it is a flexible process and can be used to manufacture a wide range of materials, some of which are difficult to produce by other methods, e.g. Al-5wt% Li alloys or Al-SiC, Al-Al 2 O 3 metal matrix composites (MMCs).
Wire arc spray is a form of thermal spraying where two consumable metal wires are fed independently into the spray gun. These wires are then charged and an arc is generated between them. The heat from this arc melts the incoming wire, which is then entrained in an air jet from the gun.
Electrostatic spray-assisted vapour deposition (ESAVD) is a technique (developed by a company called IMPT) to deposit both thin and thick layers of a coating onto various substrates. In simple terms chemical precursors are sprayed across an electrostatic field towards a heated substrate, the chemicals undergo a controlled chemical reaction and ...
Cold spray additive manufacturing (CSAM) (also called cold spray 3D printing) is a particular application of cold spraying, able to fabricate freestanding parts or to build features on existing components. During the process, fine powder particles are accelerated in a high-velocity compressed gas stream, and upon the impact on a substrate or ...
Evaporation takes place in a vacuum, i.e. vapors other than the source material are almost entirely removed before the process begins. In high vacuum (with a long mean free path), evaporated particles can travel directly to the deposition target without colliding with the background gas. (By contrast, in the boiling pot example, the water vapor ...
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
Chemical bath deposition has a long history but until recently was an uncommon method of thin-film deposition. [1]In 1865, Justus Liebig published an article describing the use of chemical bath deposition to silver mirrors (to affix a reflective layer of silver to the back of glass to form a mirror), [5] though in the modern day electroplating and vacuum deposition are more common.