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It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni 2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of ...
Variety of loose pogo pins and pogo pins in 3-pin assembly holders and with Pick and Place caps Sectional drawing of a pogo pin, showing the plunger, barrel, and spring. A pogo pin or spring-loaded pin is a type of electrical connector mechanism with spring plungers that is used in many modern electronic applications and in the electronics testing industry. [1]
The plastic connector housing is most often white, as shown (TE Connectivity / AMP 171822-4), but black is also common. Other colours are rarer. The part numbers used for the female contact pins depends on the detailed design, the surface coating (for example tinned or gold plated) and the form of supply.
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Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
Electroplating of acid gold on underlying copper- or nickel-plated circuits reduces contact resistance as well as surface hardness. Copper-plated areas of mild steel act as a mask if case-hardening of such areas are not desired. Tin-plated steel is chromium-plated to prevent dulling of the surface due to oxidation of tin.
The number of times a connector can connect and disconnect with its counterpart while meeting all its specifications is termed as mating cycles and is an indirect measure of connector lifespan. The material used for connector contact, plating type and thickness is a major factor that determines the mating cycles. [35]
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.