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Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.
Laser beam machining has the ability to engrave or cut nearly all materials, where traditional cutting methods may fall short. There are several types of lasers, and each have different uses. The cost of maintaining lasers is moderately low due to the low rate of wear and tear, as there is no physical contact between the tool and the workpiece.
Laser ablation or photoablation (also called laser blasting[1][2][3]) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the material is typically converted ...
Laser. A telescope in the Very Large Telescope system producing four orange laser guide stars. A laser is a device that emits light through a process of optical amplification based on the stimulated emission of electromagnetic radiation. The word laser is an anacronym that originated as an acronym for light amplification by stimulated emission ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Laser metal deposition (LMD) is an additive manufacturing process in which a feedstock material (typically a powder) is melted with a laser and then deposited onto a substrate. [1] A variety of pure metals and alloys can be used as the feedstock, as well as composite materials such as metal matrix composites .
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