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DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors. DDR3 is a DRAM interface specification. The actual DRAM arrays that store the data are similar to earlier types, with similar performance.
DDR SDRAM specification was finalized by JEDEC in June 2000 (JESD79). [9] JEDEC has set standards for the data rates of DDR SDRAM, divided into two parts. The first specification is for memory chips, and the second is for memory modules. The first retail PC motherboard using DDR SDRAM was released in August 2000. [10]
DDR3 memory chips are being made commercially, [11] and computer systems using them were available from the second half of 2007, [12] with significant usage from 2008 onwards. [13] Initial clock rates were 400 and 533 MHz, which are described as DDR3-800 and DDR3-1066 (PC3-6400 and PC3-8500 modules), but 667 and 800 MHz, described as DDR3-1333 ...
The DDR3 JEDEC standard for VLP DIMM height is around 0.740 inches (18.8 mm). These will fit vertically in ATCA systems. Full-height 240-pin DDR2 and DDR3 DIMMs are all specified at a height of around 1.18 inches (30 mm) by standards set by JEDEC. These form factors include 240-pin DIMM, SO-DIMM, Mini-DIMM and Micro-DIMM. [16]
The specification defines the two common units of information: [2] The bit (b) is the smallest unit of information in the binary numeration system and is represented by the digits 0 and 1. The byte (B) is a binary character string typically operated upon as one unit. It is usually shorter than a computer word.
For example, DDR3-2000 memory has a 1000 MHz clock frequency, which yields a 1 ns clock cycle. With this 1 ns clock, a CAS latency of 7 gives an absolute CAS latency of 7 ns. Faster DDR3-2666 memory (with a 1333 MHz clock, or 0.75 ns exactly; the 1333 is rounded) may have a larger CAS latency of 9, but at a clock frequency of 1333 MHz the ...
Chart #1: Side-by-Side Comparison of Leading Democratic CandidatesÕ Health Information Technology Plans As of July 20, 2007 2 Barack Obama! Adopt standards-
DDR3: Callisto 545, 550, 555, 560, 565, 570 2/4 3000–3400 2000 HT 512 6144 DDR2 DDR3: Athlon II: Propus 4 2200–2800 2000 HT 512 DDR2 DDR3: MMX, SSE, SSE2, SSE3, SSE4a, Enhanced 3DNow! Cool'n'Quiet: AMD64, NX bit, AMD-V: Rana 3 2200–3100 2000 HT 512 DDR2 DDR3: Regor 2 1600–3600 2000 HT 512, 1024 DDR2 DDR3: Sempron: Sargas 130 1 2600 2000 ...
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