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Peltier cooling plates / ˈ p ɛ l t i. eɪ / take advantage of the Peltier effect to create a heat flux between the junction of two different conductors of electricity by applying an electric current. [9] This effect is commonly used for cooling electronic components and small instruments.
Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
The Peltier effect can be used to create a heat pump. Notably, the Peltier thermoelectric cooler is a refrigerator that is compact and has no circulating fluid or moving parts. Such refrigerators are useful in applications where their advantages outweigh the disadvantage of their very low efficiency.
The flow of charge carriers between the hot and cold regions in turn creates a voltage difference. In 1834, Jean Charles Athanase Peltier discovered the reverse effect, that running an electric current through the junction of two dissimilar conductors could, depending on the direction of the current, cause it to act as a heater or cooler. [7]
Multiple Peltier junctions, taking care of each specific temperature window, can usually be stacked to further enhance the overall performance on electronics cooling. As active heat pumps which consume power, thermoelectric coolers can produce temperatures below ambient, which is impossible with passive heatsinks, radiator-cooled liquid cooling ...
The main disadvantage of Peltier coolers is low efficiency. It is estimated that materials with ZT>3 (about 20–30% Carnot efficiency) would be required to replace traditional coolers in most applications. [81] Today, Peltier coolers are only used in niche applications, especially small scale, where efficiency is not important. [131]
This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power ( TDP ), also known as thermal design point , is the maximum amount of heat that a computer component (like a CPU , GPU or system on a chip ) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo ...