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PicoBlaze is the designation of a series of three free soft processor cores from Xilinx for use in their FPGA and CPLD products. They are based on an 8-bit RISC architecture and can reach speeds up to 100 MIPS on the Virtex 4 FPGA's family.
The MicroBlaze is a soft microprocessor core designed for Xilinx field-programmable gate arrays (FPGA). As a soft-core processor, MicroBlaze is implemented entirely in the general-purpose memory and logic fabric of Xilinx FPGAs. MicroBlaze was introduced in 2002. [1]
To shrink the size and power consumption of FPGAs, vendors such as Tabula and Xilinx have introduced 3D or stacked architectures. [ 29 ] [ 30 ] Following the introduction of its 28 nm 7-series FPGAs, Xilinx said that several of the highest-density parts in those FPGA product lines will be constructed using multiple dies in one package ...
Xilinx introduced Virtex-II family in January 2001 on 150 nm process technology, [14] and Virtex-II Pro family in March 2002 on 90 nm process technology. [16] The Virtex-II and Virtex-II Pro families are considered legacy devices, and are not recommended for use in new designs, although they are still produced by Xilinx for existing designs.
Xilinx's Embedded Developer's Kit (EDK) supports the embedded PowerPC 405 and 440 cores (in Virtex-II Pro and some Virtex-4 and -5 chips) and the Microblaze core. Xilinx's System Generator for DSP implements DSP designs on Xilinx FPGAs. A freeware version of its EDA software called ISE WebPACK is used with some of its non-high-performance chips.
An Altera MAX 7000-series CPLD with 2500 gates. Die of an Altera EPM7032 EEPROM-based CPLD.Die size 3446x2252 μm. Technology node 1 μm. A complex programmable logic device (CPLD) is a programmable logic device with complexity between that of PALs and FPGAs, and architectural features of both.
To shrink the size and power consumption of FPGAs, vendors such as Tabula and Xilinx have introduced new 3D or stacked architectures. [ 7 ] [ 8 ] Following the introduction of its 28 nm 7-series FPGAs, Xilinx revealed that several of the highest-density parts in those FPGA product lines will be constructed using multiple dies in one package ...
The ULTRARAM on silicon devices actually outperform previous incarnations of the technology on GaAs compound semiconductor wafers, demonstrating (extrapolated) data storage times of at least 1000 years, fast switching speed (for device size) and program-erase cycling endurance of at least 10 million, which is one hundred to one thousand times ...