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Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. [2] [3] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. [4]
MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V GPU: TeraScale 2 (Evergreen) ; all A and E series models feature Redwood -class integrated graphics on die ( BeaverCreek for the dual-core variants and WinterPark for the quad-core variants).
Bundled with AMD Wraith Stealth; The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
Zen 2 is a computer processor microarchitecture by AMD.It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC.The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for ...
Ryzen 3 PRO 2100GE [2] found in some OEM markets in limited quantities. Ryzen (/ ˈ r aɪ z ən / RY-zən) [3] is a brand [4] of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture.
Result after a CPU benchmark ("CPU Profile") 3DMark is a computer benchmarking tool created and developed by UL (formerly Futuremark), to determine the performance of a computer's 3D graphic rendering and CPU workload processing capabilities. Running 3DMark produces a 3DMark score, with higher numbers indicating better performance.
The Sempron is a name used for AMD's low-end CPUs, replacing the Duron processor. The name was introduced in 2004, and processors with this name continued to be available for the FM2/FM2+ socket in 2015.
The LINPACK benchmark report appeared first in 1979 as an appendix to the LINPACK user's manual. [4]LINPACK was designed to help users estimate the time required by their systems to solve a problem using the LINPACK package, by extrapolating the performance results obtained by 23 different computers solving a matrix problem of size 100.