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DDR SDRAM specification was finalized by JEDEC in June 2000 (JESD79). [9] JEDEC has set standards for the data rates of DDR SDRAM, divided into two parts. The first specification is for memory chips, and the second is for memory modules. The first retail PC motherboard using DDR SDRAM was released in August 2000. [10]
Graphics Double Data Rate 6 Synchronous Dynamic Random-Access Memory (GDDR6 SDRAM) is a type of synchronous graphics random-access memory (SGRAM) with a high bandwidth, "double data rate" interface, designed for use in graphics cards, game consoles, and high-performance computing.
DDR3 memory chips are being made commercially, [11] and computer systems using them were available from the second half of 2007, [12] with significant usage from 2008 onwards. [13] Initial clock rates were 400 and 533 MHz, which are described as DDR3-800 and DDR3-1066 (PC3-6400 and PC3-8500 modules), but 667 and 800 MHz, described as DDR3-1333 ...
Double data rate SDRAM (DDR SDRAM or DDR) was a later development of SDRAM, used in PC memory beginning in 2000. Subsequent versions are numbered sequentially (DDR2, DDR3, etc.). DDR SDRAM internally performs double-width accesses at the clock rate, and uses a double data rate interface to transfer one half on each clock edge. DDR2 and DDR3 ...
DDR SDRAM operating with a 100 MHz clock is called DDR-200 (after its 200 MT/s data transfer rate), and a 64-bit (8-byte) wide DIMM operated at that data rate is called PC-1600, after its 1600 MB/s peak (theoretical) bandwidth. Likewise, 12.8 GB/s transfer rate DDR3-1600 is called PC3-12800. Some examples of popular designations of DDR modules:
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Graphics Double Data Rate 7 Synchronous Dynamic Random-Access Memory (GDDR7 SDRAM) is a type of synchronous graphics random-access memory (SGRAM) specified by the JEDEC Semiconductor Memory Standard, with a high bandwidth, "double data rate" interface, designed for use in graphics cards, game consoles, and high-performance computing.
Other memory technologies – namely HBM in version 3 and 4 [58] – aiming to replace DDR4 have also been proposed. In 2011, JEDEC introduced the Wide I/O 2 standard, which features stacked memory dies placed directly on top of the CPU within the same package. This configuration provides higher bandwidth and improved power efficiency compared ...