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  2. Pull off test - Wikipedia

    en.wikipedia.org/wiki/Pull_off_test

    A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.

  3. List of IEC standards - Wikipedia

    en.wikipedia.org/wiki/List_of_IEC_standards

    IEC 60803 Recommended dimensions for hexagonal and square crimping-die cavities, indentors, ganges, outer conductor crimp sleeves and centre contact crimp barrels for R.F. cables and connectors; IEC 60805 Guide for commissioning, operation and maintenance of storage pumps and of pump-turbines operating as pumps

  4. Pensky–Martens closed-cup test - Wikipedia

    en.wikipedia.org/wiki/Pensky–Martens_closed-cup...

    A brass test cup is filled with a test specimen and closed with a lid, through which an ignition source can be introduced periodically. The sample is heated and stirred at specified rates depending on the material that is being tested.

  5. Wafer bond characterization - Wikipedia

    en.wikipedia.org/wiki/Wafer_bond_characterization

    USB Tweezers performing cold bump pull (CPB) on a bond tester. Measuring bond strength by pull testing is often the best way to get the failure mode in which you are interested. Additionally, and unlike a shear test, as the bond separates, the fracture surfaces are pulled away from each other, cleanly enabling accurate failure mode analysis.

  6. Dye-and-pry - Wikipedia

    en.wikipedia.org/wiki/Dye-and-Pry

    Dye-n-Pry, also called Dye And Pry, Dye and Pull, Dye Staining, or Dye Penetrant, is a destructive analysis technique used on surface mount technology (SMT) components to either perform failure analysis or inspect for solder joint integrity.

  7. Charpy impact test - Wikipedia

    en.wikipedia.org/wiki/Charpy_impact_test

    The test was pivotal in understanding the fracture problems of ships during World War II. [2] [3] The test was developed around 1900 by S. B. Russell (1898, American) and Georges Charpy (1901, French). [4] The test became known as the Charpy test in the early 1900s due to the technical contributions and standardization efforts by Charpy.

  8. Modular connector - Wikipedia

    en.wikipedia.org/wiki/Modular_connector

    An 8P8C modular plug. This is the common crimp-type plug, of the same kind pictured above crimped onto a cable (with molded sleeve). A modular connector is a type of electrical connector for cords and cables of electronic devices and appliances, such as in computer networking, telecommunication equipment, and audio headsets.

  9. Paint adhesion testing - Wikipedia

    en.wikipedia.org/wiki/Paint_adhesion_testing

    In the paint and coating industries, paint adhesion testing is often used to determine if the paint or coating will adhere properly to the substrates to which they are applied. Several tests measure the resistance of paints and coatings from substrates: cross-cut test, scrape adhesion, pull-off test , and others.

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