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A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
A cryogenic processor is a device engineered to reduce the temperature of an object to cryogenic levels, typically around −300°F (−184.44°C), at a moderate rate in order to prevent thermal shock to the components being treated.
Hands-free computing is important because it is useful to both able and disabled users. Speech recognition systems can be trained to recognize specific commands and upon confirmation of correctness instructions can be given to systems without the use of hands. This may be useful while driving or to an inspector or engineer in a factory environment.
The Silent 700, introduced in 1971, [1] was a line of portable computer terminals manufactured by Texas Instruments in the 1970s and 1980s. Silent 700s printed with a 5 × 7 [2] dot-matrix heating element onto a roll of heat-sensitive paper.
Thermal vias carry heat away from power devices and are typically used in arrays of about a dozen. [2] [3] A via consists of: Barrel — conductive tube filling the drilled hole; Pad — connects each end of the barrel to the component, plane, or trace; Antipad — clearance hole between barrel and metal layer to which it is not connected
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Thermal pads can be seen in several locations on this printed circuit board (PCB), in particular, the bottom pad of the three vertical pads in the top left corner. A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection. It looks like a normal pad with ...
Thermal expansion produces mechanical stresses that may cause material fatigue, especially when the thermal expansion coefficients of the materials are different. Humidity and aggressive chemicals can cause corrosion of the packaging materials and leads, potentially breaking them and damaging the inside parts, leading to electrical failure.