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In computer science, in-memory processing, also called compute-in-memory (CIM), or processing-in-memory (PIM), is a computer architecture in which data operations are available directly on the data memory, rather than having to be transferred to CPU registers first. [1]
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins that can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just ...
The standoff provides a margin of space between the motherboard and the case to keep the multiple solder points below from grounding and short-circuiting. Usually, the standoff has a #6-32 UNC male thread on one end which screws into a threaded hole in the case or motherboard backplate and a #6-32 UNC female thread in the other end which ...
Two sizes of metal standoffs and one plastic standoff. The background depicts a standoff in use, holding a circuit board above a metal case. A standoff is a threaded separator of defined length used to raise one part in an assembly above another. They are usually round or hex (for wrench tightening), often made of stainless steel, aluminum ...
GPU-accelerated, in-memory, distributed database for analytics. Functions like a RDBMS (structured data) for fast analytics on datasets in the hundreds of GBs to tens of TBs range. Interact with SQL and REST API. Geospatial objects and functions. UDF framework allows for custom code and machine learning workloads to run in-database. Received ...
Development of 3D XPoint began around 2012. [8] Intel and Micron had developed other non-volatile phase-change memory (PCM) technologies previously; [note 1] Mark Durcan of Micron said 3D XPoint architecture differs from previous offerings of PCM, and uses chalcogenide materials for both selector and storage parts of the memory cell that are faster and more stable than traditional PCM ...
The memory module is pressed and held in place against a bar with land grid array pin contacts which connect to the motherboard. Advantages of CAMM include lower thickness, allows for replaceable LPDDR modules, faster speeds above 6400 MT/s, higher capacities up to 128 GB per module and higher memory bandwidth. Disadvantages are that it cannot ...
In 2008, High-speed mounting methods evolved through a cooperation between Reel Service Ltd. and Siemens AG in the development of a high speed mounting tape known as 'MicroTape'. By adding a tape-and-reel process into the assembly methodology , placement at high speed is possible, achieving a 99.90% pick rate and a placement rate of 21,000 cph ...