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Printed circuit board with green solder mask coating.. Solder mask, solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.
High volume production is usually done with a pick-and-place machine and bulk wave soldering for through-hole parts or reflow ovens for SMT components or through-hole parts, but skilled technicians are able to hand-solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) [29] under a microscope, using tweezers and a ...
Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm; Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
The OSP process involves delicate steps designed to ensure the uniformity and quality of the protective layer. Although environmentally friendly and suitable for microelectronic manufacturing, the complexity of the process requires strict control of the composition and quality of the coating agent to guarantee consistent board performance.
Kapton tape (yellow) used to insulate the leads of a battery cell in a bluetooth headset. Due to its large range of temperature stability and its electrical isolation ability, Kapton tape is usually used in electronic manufacturing as an insulation and protection layer on electrostatic-sensitive and fragile components.
Electrical tape (or insulating tape) is a type of pressure-sensitive tape used to insulate electrical wires and other materials that conduct electricity. It can be made of many plastics but PVC (polyvinyl chloride, "vinyl") is the most popular, as it stretches well and gives effective and long-lasting insulation.
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