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Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
Also known as laminate ball-grid array [3] TEPBGA: Thermally-enhanced plastic ball-grid array: CBGA: Ceramic ball-grid array [3] OBGA: Organic ball-grid array [3] TFBGA: Thin fine-pitch ball-grid array [3] PBGA: Plastic ball-grid array [3] MAP-BGA: Mold array process - ball-grid array : UCSP: Micro (μ) chip-scale package: Similar to a BGA (A ...
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins than can be put on a dual in-line or flat package .
However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8] Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types.
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale ...
Package on a package (PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory.Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.
In the assembly of integrated circuit packages to printed circuit boards, a head-in-pillow defect (HIP or HNP), also called ball-and-socket, [1] is a failure of the soldering process. For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may ...
Ball grid array - Interstitial Ball Grid Array (IBGA) is a type of Ball Grid Array (BGA). Redirected to main article. Redirected to main article. International Blind Golf Association - A governing organization of Blind golf associations around the world.