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  2. PCB Piezotronics - Wikipedia

    en.wikipedia.org/wiki/PCB_Piezotronics

    The 1970s for PCB Piezotronics saw expansion of its standard product offerings, to include other types of sensor technologies. In 1971, the company developed a 100,000 g high-shock, ICP® quartz accelerometer; Impulse Hammers for structural excitation were developed in 1972; and in 1973, the first rugged, industrial-grade ICP® accelerometer ...

  3. Piezotronics - Wikipedia

    en.wikipedia.org/wiki/Piezotronics

    The materials for piezotronics should be piezoelectric semiconductors, [10] such as ZnO, GaN and InN. Three-way coupling among piezoelectricity , photoexcitation and semiconductor is the basis of piezotronics (piezoelectricity-semiconductor coupling), piezophotonics (piezoelectric-photon excitation coupling), optoelectronics , and ...

  4. Piezophototronics - Wikipedia

    en.wikipedia.org/wiki/Piezophototronics

    Piezo-phototronic effect is a three-way coupling effect of piezoelectric, semiconductor and photonic properties in non-central symmetric semiconductor materials, using the piezoelectric potential (piezopotential) that is generated by applying a strain to a semiconductor with piezoelectricity to control the carrier generation, transport, separation and/or recombination at metal–semiconductor ...

  5. PCB congener list - Wikipedia

    en.wikipedia.org/wiki/PCB_congener_list

    Congener descriptors give a shorthand notation for geometry and substituent positions. The twelve congeners that display all four of the descriptors are referred to as being "dioxin-like", referring both to their toxicity and structural features which make them similar to 2,3,7,8-tetrachlorodibenzo-p-dioxin (2378-TCDD). [1]

  6. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.

  7. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...

  8. Piezoelectric accelerometer - Wikipedia

    en.wikipedia.org/wiki/Piezoelectric_accelerometer

    A description of how a piezoelectric accelerometer works in theory. A piezoelectric accelerometer is an accelerometer that employs the piezoelectric effect of certain materials to measure dynamic changes in mechanical variables (e.g., acceleration, vibration, and mechanical shock).

  9. List of semiconductor fabrication plants - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...